Advanced Packaging and Heterogeneous Integration

This course delves into cutting-edge packaging technologies beyond traditional wire bonding, including 2.5D and 3D integration, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP). Students will gain a deep understanding of the materials, processes, and design considerations required for integrating diverse semiconductor devices into a single, high-density system. Emphasis will be placed on thermal management, signal integrity, power delivery, and reliability challenges inherent in advanced packaging. Practical applications in AI, IoT, and high-performance computing will be discussed.

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Introduction to Advanced Packaging and Heterogeneous Integrationlecture

02Semiconductor Device Fundamentals for Packaginglecture

03Wafer Level Packaging (WLP) and Fan-Out Wafer Level Packaging (FOWLP)lecture

042.5D Integration: Interposers and Through Silicon Vias (TSVs)lecture

053D Integration: Chip Stacking and Monolithic 3D ICslecture

06Advanced Substrate Technologies: Organic, Ceramic, and Glasslecture

07Materials Science for Advanced Packaging: Adhesives, Underfills, and Encapsulantslecture

08Thermal Management in Advanced Packaginglecture

09Signal Integrity and Power Delivery Networks in Heterogeneous Systemslecture

10Reliability Challenges and Failure Analysis in Advanced Packageslecture

11Design Methodologies and Tools for Heterogeneous Integrationlecture

12Test and Characterization of Advanced Packaginglecture

13Supply Chain and Manufacturing Economics of Advanced Packaginglecture

14Future Trends: Photonics, Quantum, and System-in-Package Innovationslecture

Syllabus

Each week will introduce a new topic through lectures, assigned readings, and supplementary videos. Students are expected to actively participate in online discussions, submitting initial posts and responding to peers. Homework assignments, including problem sets and case studies, will reinforce conceptual understanding and practical application. A midterm exam will assess knowledge of foundational topics, and a final project will require students to propose an advanced packaging solution for a given application. Weekly quizzes will ensure consistent engagement with the material. Late submissions will incur penalties as outlined in the course policy document. Academic integrity is paramount and all work must be original. Expectations include dedicated study time, active engagement, and timely completion of all deliverables.